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EPO-TEK- H74 Thermal Epoxy
ID
AVET0H74
EPO TEK ® H74 is a two component, thermally conductive epoxy designed for hybrid circuit assembly including dieattach, substrate attach, lid-seal, heat dissipation, and hermetic sealing in general. Category:
Description
EPO TEK ® H74 is a two component, thermally conductive epoxy designed for hybrid circuit assembly including dieattach, substrate attach, lid-seal, heat dissipation, and hermetic sealing in general.
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Thermal |
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Thermal |
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Oven, Snap |
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| 2 | |
| 2 hrs | |
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45,000-65,000cPs @ 5 rpm |
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| =100°C | |
| 2.14 | |
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150°C/5 min 100°C/20 min |
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| =15 kg | |
| 1.25 W/mK | |
| 21 x 10-6 in/in/°C (below Tg) | |
| N/A | |
| N/A | |
| 90D | |
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N/A |
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Electronics Assembly, Hybrid, Medical, Optical, Semiconductor |
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Circuit / Electronic Assembly, Heat Sinking, Hybrids Microelectronics, Opto-Packaging, PCB Level Materials, Semiconductor |
Material Safety Data Sheet (MSDS): Click Here
Technical Data Sheet: Click Here
*Actual product colours may vary from on-screen and printed representations.
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