Dow Corning- 567 Sylgard Primerless

Sylgard™ 567 Primerless Silicone Encapsulant: Two-part, heat cure, 1 to 1 mix, black encapsulant with good flame resistance. Sylgard™ 567 Primerless Silicone Encapsulant is suitable for:

• General potting applications in applications like power supplies, automotive assembly, LED lighting, connectors, industrial controls, amplifiers, relays and high voltage resistor packs
• Encapsulant for solar cells

Color: Black
Dielectric Constant at 100 Hz: 2.85
Dielectric Constant at 100 kHz: 2.79
Dielectric Strength: 405 volts per mil v/mil
Dielectric Strength (kV/mm): 16 kV/mm
Dissipation Factor at 100 Hz: 0.008
Dissipation Factor at 100 kHz: 0.002
Durometer - Shore A: 40 Shore A
Heat Cure: 120 Minutes @ 100 Deg C
Heat Cure: 180 Minutes @ 70 Deg C
Linear CTE: 300 um/m/Deg C
Mix Ratio: A/B 1:1
Temperature Range: -45 Deg C to 200 Deg C
Thermal Conductivity: 0.29 Watts per meter K
Viscosity (Part A): 2060 mPa.s
Viscosity (Part B): 570 mPa.s

*Actual product colours may vary from on-screen and printer representations.