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EPO-TEK- H22 Electrical Epoxy
ID
AVET0H22
EPO-TEK® H22 is a two component, silver-filled epoxy system designed specifically for die bonding and sealing hybrid circuit packages. Category:
Description
EPO-TEK® H22 is a two component, silver-filled epoxy system designed specifically for die bonding and sealing hybrid circuit packages.
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Electrical |
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Electrical, Thermal |
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Oven, Snap |
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| 2 | |
| 16 Hours | |
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12,000-20,000cPs @ 20 rpm |
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| =100°C | |
| 2.36 | |
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150°C/5 min 120°C/10 min 100°C/20 min 80°C/45 min |
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| =5 kg | |
| 0.94 W/mK | |
| 39 x 10-6 in/in/°C (below Tg) | |
| N/A | |
| N/A | |
| 80D | |
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N/A |
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Electronics Assembly, Hybrid, Medical |
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Circuit / Electronic Assembly, Electrically Conductive, Heat Sinking, Hybrids Microelectronics, LCDs, LEDs, PCB Level Materials, Semiconductor , Solder Replacement, Wafer Level |
Material Safety Data Sheet (MSDS): Click Here
Technical Data Sheet: Click Here
*Actual product colours may vary from on-screen and printed representations.
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