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EPO-TEK- H67-MP Thermal Epoxy
ID
AVET67MP
EPO-TEK® H67MP is a single component, thermally conductive epoxy for military hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging. Category:
Description
EPO-TEK® H67MP is a single component, thermally conductive epoxy for military hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging.
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Thermal |
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Thermal |
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Oven |
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| 1 | |
| 28 days | |
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300,000-400,000cPs @ 1 rpm |
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| =90°C | |
| N/A | |
| 150°C/1 hr | |
| =20 kg | |
| 0.45 W/mK | |
| 16 x 10-6 in/in/°C (below Tg) | |
| N/A | |
| N/A | |
| 84D | |
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N/A |
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Electronics Assembly, Hybrid, Medical, Semiconductor |
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Circuit / Electronic Assembly, Glob Top, Heat Sinking, Hybrids Microelectronics, LEDs, Medical Epoxies, Non-Conductive, Packaging Materials, PCB Level Materials, Potting, Semiconductor , Wafer Level |
Material Safety Data Sheet (MSDS): Click Here
Technical Data Sheet: Click Here
*Actual product colours may vary from on-screen and printed representations.
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