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EPO-TEK- H70E Thermal Epoxy
ID
AVETH70E
EPO-TEK®H70E is a two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications. Category: Thermal Conductivity: Thermal
Description
EPO-TEK®H70E is a two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.
| Thermal |
|
| Thermal |
|
| Oven, Snap |
|
| 2 | |
| 56 hrs | |
| 4,000-7,000cPs @ 50 rpm |
|
| =80°C | |
| 1.17 | |
| 175°C/1 min 150°C/5 min 120°C/15 min 80°C/90 min |
|
| =10 kg | |
| 0.9 W/mK | |
| 15 x 10-6 in/in/°C (below Tg) | |
| N/A | |
| N/A | |
| 83D | |
| N/A |
|
| Electronics Assembly, Hybrid, Optical, Semiconductor |
|
| Circuit / Electronic Assembly, Glob Top, Heat Sinking, Hybrids Microelectronics, LEDs, Non-Conductive, Packaging Materials, PCB Level Materials, Potting, Semiconductor , Wafer Level |
Material Safety Data Sheet (MSDS): Click Here
Technical Data Sheet: Click Here
*Actual product colours may vary from on-screen and printed representations.
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