EPO-TEK- TJ1183-LH Adhesive

ID AVET83LH
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A single component, low-halogen, electrically insulating die attach adhesive with extended pot life. Category: Thermal Conductivity: Thermal Cure Type: Oven Number of
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Description

A single component, low-halogen, electrically insulating die attach adhesive with extended pot life.

Thermal
Thermal
Oven
1
9 days
40,139cPs
@ 10 rpm
108°C
2.6
150°C/1 hr
29.5 kg
0.38 W/mK
N/A x 10-6 in/in/°C (below Tg)
N/A
N/A
N/A
N/A
Electronics Assembly,
Hybrid,
Medical,
Semiconductor
Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Medical Epoxies,
Non-Conductive,
PCB Level Materials,
Semiconductor


Material Safety Data Sheet (MSDS): Click Here
Technical Data Sheet: Click Here

*Actual product colours may vary from on-screen and printed representations.
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